Optomec and partners develop cost-effective copper inks for printed electronics

Published: May 07, 2017

Optomec, Albuquerque, N.M., announces significant improvements in the ability to effectively print and post-process copper and copper/nickel (i.e., Constantan) inks on its Aerosol Jet systems.

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ClassOne copper plating chamber cuts costs for plating 200-mm wafers by 95%

Published: April 24, 2017

ClassOne Technology, Kalispell, Montana, has developed the CopperMax plating chamber, a design that is said to extend bath life by a factor greater than 20.

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Global semiconductor wafer-level equipment revenue increased 11% in 2016

Published: April 24, 2017

Gartner Inc., Stamford, Conn., reports that worldwide semiconductor wafer-level manufacturing equipment (WFE) revenue totaled $37.4 billion in 2016, an 11.3% increase from 2015.

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Black phosphorus could replace silicon in semiconductors to make smaller devices

Published: April 24, 2017

Yale University, New Haven, Conn., announces that a research team recently discovered that black phosphorus could possibly replace silicon as the primary material for electronics.

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Kulicke & Soffa opens process and applications laboratory in The Netherlands

Published: April 24, 2017

Kulicke & Soffa Industries Inc., Singapore, has opened a new Process and Applications laboratory at the K&S Netherlands facility in Eindhoven.

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Global Foundries to expand in the United States, Germany, China, Singapore

Published: April 24, 2017

Global Foundries, Santa Clara, Calif., announces plans to expand its global manufacturing footprint in response to growing customer demand for its comprehensive and differentiated technology portfolio.

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Bruker introduces software and hardware NMR spectroscopy solutions

Published: April 24, 2017

Bruker, Billerica, Mass., announces new software and hardware products that address the need for enhanced workflow solutions for NMR spectroscopy research and analysis.

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SUSS MicroTec launches automated permanent wafer bonding system

Published: April 24, 2017

SUSS MicroTec, Germany, has launched the XBS200 automated permanent wafer bonding system designed for aligned wafer bonding of wafer sizes up to 200 mm.

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Taiwan Semiconductor to join SRC project to optimize materials and processes

Published: April 24, 2017

Semiconductor Research Corporation (SRC), Durham, N.C., announces that Taiwan Semiconductor Manufacturing Company, Ltd., (TSMC) has signed an agreement to participate in two SRC research initiatives.

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Mentor Graphics joins Siemens lifecycle management software business

Published: April 24, 2017

Siemens AG, Munich, announces the recent closing of its acquisition of Mentor Graphics Corp., Wilsonville, Ore., which is now part of Siemens' product lifecycle management software business.

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