Exelsius and Acxys partner for plasma coating printed circuit boards

Published: November 06, 2016

Exelsius, France, has teamed up with Acxys Technologies, also of France, to leverage the latest technological developments for the surface preparation and coating of printed circuit boards.

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Buehler IsoMet High Speed precision cutter enables consistent metal sample sectioning

Published: November 01, 2016

Buehler, Lake Bluff, Ill., introduces the IsoMet High Speed, a precision sectioning machine designed specifically to create consistent and efficient cuts in metals and other materials using diamond or abrasive blades.

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University at Buffalo receives $2.9 million for modeling/simulations lab

Published: October 28, 2016

The University at Buffalo, N.Y., has received a $2.9 million National Science Foundation grant to transform the traditional role of a database as a repository for information into an automated computer laboratory that rapidly collects, interprets, and learns from massive amounts of information.

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Pulsed electron beams enable rapid deposition of Ga-La-S thin films

Published: October 24, 2016

The University of Southampton, England, announces that a research group has developed a rapid deposition technology in which pulsed beams of electrons break up a gallium-lanthanum-sulfur (GLS) glass target material and deposit it as a thin film onto a substrate at a rate greater than 0.2 microns/minute.

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Oxford Instruments develops SiC via etch for RF devices

Published: October 24, 2016

Oxford Instruments, Concord, Mass., announces that it has developed a silicon carbide via plasma etch process based on its PlasmaPro100 Polaris etch system.

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Qualcomm Technologies opens semiconductor test facility in Shanghai

Published: October 24, 2016

Qualcomm Inc., San Diego, announces the opening of Qualcomm Communication Technologies (Shanghai) Co. Ltd., a semiconductor test facility in the WGQ free-trade zone in Shanghai, and its first venture into providing manufacturing services for semiconductors.

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Linde invests $5.4 million in Taiwan R&D Center

Published: October 24, 2016

The Linde Group, Murray Hill, N.J., has invested approximately $5.4 million to establish a Linde Electronics R&D Center in Taiwan to support local customers and development partners with its state-of-the-art analytical and product development laboratory.

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Applied Materials extends R&D partnership with Singapore’s Institute of Microelectronics

Published: October 23, 2016

Applied Materials Inc., Santa Clara, Calif., and the Institute of Microelectronics, Singapore, announce a five-year extension of their research collaboration at the Centre of Excellence in Advanced Packaging in Singapore.

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Wafer shipments forecast to increase in 2016, 2017, and 2018

Published: October 23, 2016

SEMI, San Jose, Calif., recently completed its annual silicon shipment forecast for the semiconductor industry, providing an outlook for the demand in silicon units for the period 2016–2018.

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Toshiba expands 24nm SLC NAND flash lineup to extend product lifetimes

Published: October 23, 2016

Toshiba America Electronic Components Inc., Irvine, Calif., has expanded its family of 24nm single-level cell (SLC) NAND flash memory solutions.

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