Hitachi high-voltage CD-SEM measures high aspect-ratio trenches and contact holes

Published: November 19, 2016

Hitachi High-Technologies Corp., Japan, launches its Advanced High Voltage CD-SEM - CV5000 Series, which is capable of measuring high aspect-ratio trenches and contact holes, as well as measuring device patterns.

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Siemens to acquire Mentor Graphics for its electronics IC and systems design

Published: November 14, 2016

Siemens AG, Munich, and Mentor Graphics, Wilsonville, Ore., announce that they have entered into a merger agreement under which Siemens will acquire Mentor for its electronics IC and systems design, simulation, and manufacturing solutions.

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Optotherm radiometric infrared camera based on amorphous silicon microbolometers

Published: November 14, 2016

Optotherm, Sewickley, Pa., recently developed the IS640 radiometric infrared camera designed for thermographic applications requiring high sensitivity, resolution, and accuracy.

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Suss MicroTec launches coat and develop solution for advanced packaging

Published: November 13, 2016

Suss MicroTec, Germany, has launched its new generation of the fully automated ACS300 Gen3 platform specifically designed for high volume manufacturing of advanced packaging applications such as wafer-level chip scale packaging, fan-out wafer-level packaging, copper pillar flip-chip, and 3D packaging.

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Bruker introduces nano-scratch capability for nanomechanical testing

Published: November 13, 2016

Bruker's Nano Surfaces Division, San Jose, Calif., announces a nanoscale scratch option for its NanoForce Nanomechanical Testing System.

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Metamaterials enable the first optically controlled electronic devices

Published: November 13, 2016

Engineers from the Applied Electromagnetics Group at the University of California San Diego report that they have fabricated the first semiconductor-free, optically controlled microelectronic device.

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Astronics Test Systems semiconductor test platform processes 396 devices at once

Published: November 13, 2016

Astronics Test Systems, East Aurora, N.Y., introduces its ATS 5034 System-Level Test Platform that improves production efficiency and greatly reduces costs by processing up to 396 devices simultaneously.

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Samsung expands its advanced foundry products portfolio with 14LPU/10LPU processes

Published: November 13, 2016

Samsung Electronics Co. Ltd., Japan, announced at its Device Solutions America headquarters in San Jose, Calif., that it is expanding its advanced foundry process technology products with the fourth-generation 14-nm process and the third-generation 10-nm process.

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Zeiss and ASML strengthen partnership for EUV semiconductor lithography

Published: November 13, 2016

ASML Holding NV, Netherlands, and Carl Zeiss SMT, Germany, have agreed to strengthen their partnership in the semiconductor lithography business to facilitate the development of the next generation of extreme ultraviolet (EUV) lithography systems.

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Qualcomm to buy NXP Semiconductors for its automotive and security systems

Published: November 13, 2016

Qualcomm Inc., San Diego, Calif., announces a definitive agreement to acquire NXP Semiconductors N.V., Netherlands, for about $38 billion because of its leading positions in automotive infotainment, networking, and safety systems, with solutions designed into 14 of the top 15 infotainment customers in 2016.

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