NIST releases guide to fractography of ceramics and glasses

Published: September 18, 2016

NIST, Gaithersburg, Md., has released a new, expanded edition of the NIST Recommended Practice Guide, "Fractography of Ceramics and Glasses" (NIST Special Publication 960-16e2), a guide developed to help engineers and scientists analyze the patterns in fractures of ceramics and glasses.

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SEMI and MSIG to join in strategic association partnership

Published: September 18, 2016

Semi, San Jose, Calif., announces that MEMS & Sensors Industry Group (MSIG) will become a Strategic Association Partner effective January 1, 2017.

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SAS lab provides failure analysis and supports process development

Published: September 18, 2016

Semiconductor Analytical Services Inc., Milpitas, Calif., has opened a new analytical laboratory to support process development and production of microelectronic devices and other high-technology products.

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Global GaN semiconductor devices market to be worth $3.4 billion by 2024

Published: September 18, 2016

Transparency Market Research (TMR), Pune, India, reports that its analysis shows the global market for gallium nitride semiconductor devices will rise from $870.9 million in 2015, to $3.4 billion by 2024.

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ASM Appoints New Managing Director

Published: September 13, 2016

The ASM International Board of Trustees announces the appointment of William T. (Bill) Mahoney as Managing Director effective immediately.

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SEMI forecasts 19 new fabs and lines to be built this year and next

Published: August 22, 2016

SEMI, San Jose, Calif., forecasts that 19 new fabs and lines will be built in 2016 and 2017, according to the latest update of the SEMI World Fab Forecast report.

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New Imec Florida to focus on photonics and high-speed integrated circuits

Published: August 22, 2016

Imec, San Francisco, a nanoelectronics research center, has opened Imec Florida, a new entity focusing on photonics and high-speed electronics IC design based in Osceola.

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GlobalWafers to acquire SunEdison Semiconductor for its global footprint

Published: August 22, 2016

GlobalWafers Co. Ltd., Taiwan, announces that it has agreed to acquire SunEdison Semiconductor Ltd., Singapore, because of SunEdison's expansive global footprint and product development capabilities.

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Helios G4 CX plasma focused ion beam instrument enables nanometer analysis

Published: August 22, 2016

FEI Co., Hillsboro, Oregon, announces that the latest technological innovations of the Helios G4 CX plasma-focused ion beam instrument, in combination with comprehensive software and FEI's application expertise, allow Helios G4 CX with optional AS&V4 software to acquire the highest-quality multi-modal 3D datasets.

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Analog Devices to acquire Linear Technology to bridge analog and digital worlds

Published: August 20, 2016

Analog Devices Inc., Norwood, Mass., and Linear Technology Corp., Milpitas, Calif., announce that they have entered into a definitive agreement under which Analog Devices will acquire Linear Technology in a cash and stock transaction that values the combined enterprise at approximately $30 billion.

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