E-beam wafer inspection system provides high resolution, fast throughput

Published: August 20, 2016

Applied Materials Inc., Santa Clara, Calif., announces that its next-generation ProVision e-beam wafer inspection system delivers the highest resolution and image quality at the fastest throughput to foundry, logic, DRAM, and 3D NAND customers as they move to advanced nodes.

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Tokyo Electron joins Semiconductor Research Corporation

Published: August 19, 2016

Semiconductor Research Corp., Durham, N.C., announces that Tokyo Electron Limited has joined SRC's Nanomanufacturing Materials and Processes initiative.

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Mentor Graphics launches new Xpedition enterprise platform

Published: August 19, 2016

Mentor Graphics Corp., Wilsonville, Ore., announces the first phase of the new Xpedition printed circuit design flow to address the increasing complexity of today's advanced systems.

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ALD process developed for low-fluorine tungsten films

Published: August 19, 2016

Lam Research Corp., Fremont, Calif., an advanced manufacturer of semiconductor equipment,introduces an atomic layer deposition process for depositing low-fluorine-content tungsten films, the latest addition to its Altus family of products.

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Fluorescent microcapsules identify microscopic failure

Published: August 18, 2016

The Autonomous Materials Systems Group at the Beckman Institute for Advanced Science and Technology, Urbana, Ill., recently devised a way to identify microscopic damage in polymers and composites by incorporating microcapsules containing materials that fluoresce under stress.

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Bruker e-FlashFS/e-FlashHd detectors enable fast, sensitive EBSD analysis

Published: August 18, 2016

Bruker Nanoanalytics, Germany, introduces the e-FlashFS and e-FlashHD, two models of a new generation of detectors for electron backscatter diffraction analysis on scanning electron microscopes; and Esprit Qube, a new software package for advanced post-processing and visualization of 3D EBSD/EDS data cubes.

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Instron Torsion Add-On enables simultaneous axial and torsion tests

Published: August 18, 2016

Instron, Norwood, Mass., has designed the Instron Torsion Add-On for simple simultaneous axial and torsional testing to ensure the performance of many consumer products, packaging, electronics, and medical devices.

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Pathfinder X-ray microanalysis software maps chemical constituents

Published: August 18, 2016

Thermo Fisher Scientific, Boston, introduces Pathfinder X-ray microanalysis software, which is designed to process incoming data from X-ray detector technology and to provide a real-time statistical map of the chemical constituents within a sample.

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EAG Laboratories combines 11 labs into one company

Published: August 17, 2016

EAG Inc., San Diego, announces that it has formed EAG Laboratories, a single entity combining all of its 11 labs, including Evans Analytical Group, ABC Laboratories, Chemir Analytical Services, SEAL Laboratories, Shiva Technologies, NanoScience, Accurel, and MEFAS, among others.

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Asian electronic company selects Harper for elevator furnaces

Published: July 27, 2016

Harper International, Buffalo, N.Y., has been selected by a leading Asian electronic components firm for the design of two high-temperature elevator furnaces for its production plant.

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