Advanced Mask and Bond Aligners enable more accurate wafer processing

Published: July 01, 2016

Suss MicroTec, Germany, has launched the fourth generation of its semi-automated Mask and Bond Aligners, including a new platform system and major improvements in alignment accuracy, ergonomic design, and further reduced cost of ownership.

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Allvia expands capacity to manufacture wafers with glass and quartz interposers

Published: July 01, 2016

Allvia, Sunnyvale, Calif., has expanded its capacity for glass and quartz via manufacturing to accommodate customer requests in via-fill technology from silicon interposers to glass and quartz interposers.

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Extreme selectivity etch tool enables atomic-level precision for 3D logic chips

Published: July 01, 2016

Applied Materials Inc., Santa Clara, Calif., introduces its Applied Producer Selectra System, the industry's first extreme selectivity etch tool that presents new materials engineering capabilities for continued scaling of 3D logic and memory chips.

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SEMI report: 19 new fabs and lines to start construction

Published: June 19, 2016

SEMI, San Jose, Calif., announces that 19 new fabs and lines are forecast to begin construction in 2016 and 2017, according to the latest update of the SEMI World Fab Forecast report.

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FEI launches three tools for next-generation semiconductor failure analysis

Published: June 19, 2016

FEI Co., Hillsboro, Ore., introduces three new tools for process control and defect/failure analysis in advanced semiconductor manufacturing: the Helios G4 DualBeam EXL, The Metrios DX TEM, and the ExSolve 2 WTP.

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Thermo Fisher Scientific acquires FEI Company for $4.2 billion

Published: June 19, 2016

Thermo Fisher Scientific Inc., Waltham, Mass., announces that it is to acquire FEI Co., Hillsboro, Ore., for approximately $4.2 billion.

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Large-area ALD system enables encapsulation of large sheets of organic components

Published: June 18, 2016

Picosun Oy, Finland, has developed atomic layer deposition (ALD) equipment specifically designed for large-area flexible electronics encapsulation.

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IBM scientists achieve phase-change memory breakthrough

Published: June 18, 2016

IBM Research, Schenectady, N.Y., reports that its scientists have demonstrated reliably storing three bits of data per cell using a relatively new memory technology known as phase-change memory (PCM).

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Multifunctional heating and electrical system enables in-situ TEM and SEM analysis

Published: June 18, 2016

Protochips, Morrisville, N.C., has released its Fusion multi-functional heating and electrical system for in-situ electron microscopy.

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Pulsed magnetic field instrument incorporating lasers enables 100 measurements per pulse

Published: June 17, 2016

The University of Manchester, England, announces that a research team has developed a pulsed magnetic field instrument incorporating ultrafast lasers that enable 100 measurements per pulse, with the goal of facilitating rapid progress in semiconductor device development.

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