Amkor receives “Device of the Year” for SWIFT semiconductor package

Published: July 25, 2016

Amkor Technology Inc., Tempe, Ariz., recently received the 3D InCites "Device of the Year" award during SEMICON West for its SWIFT semiconductor package.

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Rudolph Clearfind Technology detects organic defects

Published: July 25, 2016

Rudolph Technologies Inc., Wilmington, Mass., introduces its Clearfind technology, which can detect organic defects that are difficult or impossible to see with conventional white-light imaging techniques.

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Coventor wins “Best of West” Award

Published: July 25, 2016

Coventor, Cary, N.C., announces that it has won the "Best of West" award presented by Solid State Technology and SEMI a the Semicon West conference July 13.

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Nondestructive hybrid system integrates XRF and 3D optical methods

Published: July 25, 2016

XwinSys, Carefree, Ariz., recently launched the Onyx, a novel in-line and nondestructive hybrid metrology system that uniquely integrates advanced XRF with 2D and 3D optical technologies.

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Helios PFIB enables advanced failure analysis of semiconductors

Published: July 25, 2016

FEI Co., Hillsboro, Ore., offers the Helios PFIB, said to be the world's most advanced DualBeam Plasma FIB platform for large area deprocessing to enable electrical fault isolation of advanced process ICs and advanced failure analysis of 3D packages.

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X-ray metrology system designed for in-line monitoring of logic devices

Published: July 25, 2016

Bruker Corp., Billerica, Mass., Germany, announces that multiple leading logic and foundry manufacturers have selected Bruker's JVX7300LSI X-ray metrology system to support their ramp and development for 10 nm and 7/5 nm technology nodes.

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Cadence announces Intel- certified implementation and signoff tools

Published: July 25, 2016

Cadence Design Systems Inc., San Jose, Calif., announces that its implementation and signoff tools have achieved certification on the Intel third-generation 10 nm tri-gate process for customers of Intel Custom Foundry.

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Hitachi Conductor etch system supports double patterns and 3D structures

Published: July 25, 2016

Hitachi High-Tech, Schaumburg, Ill., has developed the 9000 Conductor Etch Series to support next-generation devices at 20 nm and below that require double-patterning, 3D structures, and complex, high-precision processes.

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Mentor Graphics to provide access to AMS design flow for ARM Cortex-M0

Published: July 25, 2016

Mentor Graphics Corp., Wilsonville, Ore., has announced a collaboration with ARM to provide accessible and affordable access to Mentor's Tanner AMS analog/mixed-signal design flow for ARM Cortex-M0 processor-based implementations as part of the ARM DesignStart program.

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Roger Jones of Solar Atmospheres nominated as ASM Trustee

Published: July 06, 2016

Solar Atmospheres, Souderton, Pa., announces that Roger Jones, corporate president, has been nominated as a trustee for the ASM International Board of Trustees, effective October 2016.

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