Bruker launches compact research grade Raman microscope

Published: May 19, 2016

Bruker, Munich, Germany, launches the Senterra II compact Raman microscope, with a fully redesigned spectrograph that can achieve higher spectral resolution in addition to higher performance compared to previous models.

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FEI launches Apreo high-performance SEM

Published: May 19, 2016

FEI Co., Hillsboro, Ore., introduces the Apreo SEM, which provides high-resolution surface information with excellent contrast, and has the flexibility to accommodate a wide range of samples, applications, and conditions.

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ON Semiconductor extends tender offer to acquire Fairchild Semiconductor

Published: May 19, 2016

ON Semiconductor Corp., Phoenix, has extended its previously announced tender offer to purchase all of the outstanding shares of common stock of Fairchild Semiconductor International Inc. for $20.00 per share in cash to May 26, unless further extended.

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Oxford Instruments launches software platform for Maxxi 6 coating analyzer

Published: May 19, 2016

Oxford Instruments, Abingdon, U.K., enhances the Maxxi 6 coating thickness and materials analyzer with the introduction of SmartLink software, combining powerful yet easy-to-use software with high-resolution detector technology.

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Intel announces restructuring initiative to accelerate transformation

Published: May 19, 2016

Intel Corp., Santa Clara, Calif., announces a restructuring initiative to accelerate its evolution from a PC company to one that powers the cloud and billions of smart, connected computing devices.

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Witec entry-level micro-Raman microscope system is easily upgraded

Published: May 19, 2016

Witec, Germany, introduces the newly developed Alpha300 Access microscope, an entry-level system for micro-Raman single-spot analysis and Raman mapping that extends WITec's product portfolio to lower price segments.

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Flextech announces completion of three flexible hybrid electronics projects

Published: May 19, 2016

FlexTech, a Semi Strategic Association Partner, San Jose, Calif., announces the formal completion of three flexible hybrid electronics R&D projects under its U.S. Army Research Laboratory technology investment agreement.

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Variable-pressure SEM achieves 4-nm resolution

Published: May 19, 2016

Hitachi High Technologies America Inc., Schaumburg, Ill., has released the FlexSEM 1000, a compact SEM system with a minimized, lab-friendly footprint, 6 to 100 Pa variable pressure, and 4 nm resolution, while offering superior ease of use for operators of all skill levels.

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Mentor Graphics Valor software streamlines PCB assembly planning

Published: May 19, 2016

Mentor Graphics Corp., Wilsonville, Ore., announces that its Valor Production Plan software has been certified by SAP as powered by the SAP NetWeaver technology platform, streamlining PCB assembly planning, including surface mount technology, manual assembly, and test.

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Tezzaron cuts design time in half with Cadence SoC solution

Published: May 19, 2016

Cadence Design Systems Inc., San Jose, Calif., announces that Tezzaron Semiconductor has adopted the Cadence full-flow digital register-transfer level (RTL)-to-signoff solution for its networking and supercomputing system on chips, cutting its development schedules in half.

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