ASM forms strategic alliance with SVC

Published: May 04, 2016

The new strategic alliance brings the complementary strengths of both organizations together to better serve their global members and the community at large.

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Rick Sisson Wins Trustees Research & Creative Scholarship Award

Published: April 28, 2016

ASM Fellow Richard D. Sisson has received Worcester Polytechnic Institute's 2016 Board of Trustees' Award for Outstanding Research and Creative Scholarship.

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Tescan presents May 4 webinar on “Failure Analysis of Microelectronic Devices”

Published: April 28, 2016

Tescan, Czechoslovakia, will present a webinar on "Failure analysis of Microelectronic Devices" Wednesday May 4 at 9 am EDT.

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IC failure analysis lab acquires optical microscope with multi-sensor optical head

Published: April 25, 2016

Quantum Focus Instruments, Vista, Calif., announces that Innovative Circuits Engineering, a Silicon Valley integrated circuit test services business, has expanded its semiconductor failure analysis offerings through the acquisition of a QuantumScope failure analysis microscope.

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Cadence Virtuoso LDE analyzer helps accelerate designs to production

Published: April 25, 2016

Cadence Design Systems Inc., England, announces that Cadence Virtuoso Layout-Dependent Effects (LDE) analyzer has been qualified by United Microelectronics Corporation (UMC) to support its 28HPCU process technology.

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North American semiconductor 2015 market report

Published: April 24, 2016

Semi, San Jose, Calif., reports that the global semiconductor materials market decreased by 1.5% in 2015 compared to 2014, while worldwide semiconductor revenues decreased by 0.2 %.

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2016 Pittcon Heritage Award presented to JEOL founders

Published: April 24, 2016

The 2016 Pittcon Heritage Award, jointly sponsored by the Pittsburgh Conference on Analytical Chemistry and Applied Spectroscopy (Pittcon) and the Chemical Heritage Foundation (CHF), has been presented to Kenji Kazato (1917-2012) and Kazuo Ito (1921- ), who led a group of scientists in Japan to develop an electron microscope.

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Dual-beam laser spike anneal system enables process flexibility in chip production

Published: April 24, 2016

Ultratech Inc., San Jose, Calif., announces a follow-on order from a major foundry for its LSA101 laser spike anneal system equipped with the dual-beam option, which provides a second low-power laser that adds flexibility to chip production.

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Samsung mass produces first 10-nm class DRAM

Published: April 24, 2016

Samsung Electronics Co. Ltd., Korea, has begun mass producing the industry's first 10-nm class 8Gb DDR4 (double-data-rate-4) DRAM chips and the modules derived from them.

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Sandia National Laboratories licenses Invensas ZiBond and DBI electronic bonding technologies

Published: April 24, 2016

Invensas Corp., San Jose, Calif., announces that Sandia National Laboratories has signed a new license agreement for ZiBond low-temperature homogeneous bonding technology and for Direct Bond Interconnect (DBI) technology, a low-temperature, hybrid bonding technology for integrated electrical interconnects.

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