Imec opens 300mm cleanroom for 7nm and beyond chip scaling

Published: March 19, 2016

Imec, Belgium, announces the opening of its new 4000-square-meter cleanroom facility dedicated to scaling IC technology beyond 7nm, bringing the total floor space of its semiconductor research cleanrooms to 12,000 square meters.

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Taiwan is new global leader in total IC wafer fab capacity

Published: March 19, 2016

IC Insights, Scottsdale, Ariz., recently released its new "Global Wafer Capacity 2016-2020" report showing that, as of December 2015, Taiwan is now the global leader in wafer capacity with nearly 22% of worldwide IC capacity installed in the country.

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Market for GaN and SiC power semiconductors to top $1B in 2020

Published: March 19, 2016

IHS Inc., Englewood, Colo., reports that the emerging market for silicon carbide and gallium nitride power semiconductors is forecast to pass the $1 billion mark in five years, energized by demand from hybrid and electric vehicles, power supplies, and photovoltaic inverters.

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Advanced power amplifiers enable faster data access, better connections

Published: March 19, 2016

Global Foundries, Santa Clara, Calif., announces advanced radio-frequency silicon solutions for power amplifiers, further expanding the portfolio of silicon-germanium power amplifier technologies designed to enable performance-optimized cellular and Wi-Fi devices.

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Amkor receives quality award from Intel

Published: March 19, 2016

Amkor Technology Inc., Tempe, Ariz., has been recognized as one of 26 companies receiving Intel Corporation's Preferred Quality Supplier award for its performance in 2015.

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Bruker FTIR SiBrickScan detects oxygen in silicon ingots

Published: March 19, 2016

Bruker Optics Inc., Billerica, Mass., announces the Bruker SiBrickScan, said to be the first at-line FTIR instrument allowing for the quantification of interstitial oxygen in complete silicon bricks and ingots.

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Toshiba to invest $3.2 billion in 3D flash-memory chip factory

Published: March 19, 2016

Toshiba Corp., Japan, announces that it will invest $3.2 billion in a new factory for BiCS Flash, its proprietary 3D flash memory chips.

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Standalone semiconductor workstation can be customized

Published: March 19, 2016

Brewer Science, Rolla, Mo., introduces the Cee X-Pro II workstation, a clean room environment in a stand-alone, completely customizable system that provides the user with complete control over the environmental conditions within the workstation.

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NIST ultrasound method detects cracks in capacitors

Published: March 03, 2016

The National Institute of Standards and Technology, Gaithersburg, Md., and collaborators have demonstrated a nondestructive acoustic method for detecting cracks in ceramic capacitors before they go bad.

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Helios G4 HX designed for advanced semiconductor failure analysis labs

Published: February 29, 2016

FEI Co., Hillsboro, Oregon, announces that the new Helios G4 HX utilizes a patented inverted TEM sample preparation method to create high-quality lamellas for the most advanced semiconductor nodes.

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