ESD Alliance, Semico Research sign joint marketing agreement

Published: April 24, 2016

The Electronic System Design (ESD) Alliance, San Jose, Calif., and Semico Research, Phoenix, Ariz., announce that they have entered into a joint marketing agreement to work together on several business initiatives in support of the semiconductor design ecosystem.

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Amkor ships 700 million RF and advanced SIP modules for mobile devices

Published: April 24, 2016

Amkor Technology Inc., Tempe, Ariz., announces that it has shipped 700 million RF and front-end advanced system-in-package (SIP) modules for mobile device applications.

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Software enables automated reporting of surface analyses from 3D optical microscopes

Published: April 24, 2016

Bruker Corp., San Jose, Calif., and Digital Surf, France, announce that Bruker Nano Surfaces is offering Vision64 Map data analysis and reporting software, which enables streamlined access to automated reporting of advanced surface measurements in 11 languages, while ensuring compatibility across a wide range of industry standards.

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Advanced thermal imaging cameras can detect temperature differences of 1 mK

Published: April 20, 2016

Flir Systems, Wilsonville, Oregon, has developed X6000sc and X8000sc series thermal imaging cameras with Lock-In, Transient, and Pulse capabilities that can resolve temperature differences as low as 1 mK for advanced inspections.

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Moticam CMOS camera with Android tablet attaches to optical microscope

Published: March 29, 2016

Ted Pella Inc., Redding, Calif., offers Moticam CMOS cameras with attached Android tablet, as well as Bluetooth, a Quad Core CPU, and 16 gigabits of internal storage.

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Keyence VHX -5000 microscope enables IMR Test Labs to speed turnaround

Published: March 29, 2016

IMR Test Labs, Lansing, N.Y., now offers metallurgical services using a Keyence VHX-5000 microscope, which allows IMR to provide enhanced 3D, free-angle imaging at magnifications previously not available, which enables more-accurate measurements and photomicrographs of samples.

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IBC to supply Beralcast components to semiconductor manufacturer

Published: March 20, 2016

IBC Advanced Alloys Corp., Vancouver, has signed an agreement with a leading global manufacturer of semiconductor and electronics assembly equipment to be its exclusive supplier of Beralcast beryllium-aluminum cast components.

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Jeol Neoscope SEM enables rapid inspection of electronics

Published: March 19, 2016

Jeol USA, Peabody, Mass., introduces a new benchtop SEM, the JSM-6000Plus, the third generation of the NeoScope, which delivers fast, high-magnification electron microscopy with more functionality than typical benchtop SEMs.

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Cadence develops design and analysis solution for wafer-level chip scale packaging

Published: March 19, 2016

Cadence Design Systems Inc., San Jose, Calif., offers a foundry-proven IC packaging design and analysis solution for advanced fan-out Wafer-Level Chip Scale Packaging (WLCSP) and 2.5D interposer-based designs.

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Oxford Instruments Aztec One XT software platform simplifies EDS analysis

Published: March 19, 2016

Oxford Instruments, has launched the Aztec One XT system, an ideal solution for those who want to perform a complex task such as EDS as quickly and as easily as possible.

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