Cadence debuts product for reducing test time, costs

Published: February 21, 2016

Cadence Design Systems, San Jose, Calif., introduces the Modus Test Solution, a product that reportedly enables design engineers to reduce test time by up to a factor of three, thereby reducing production test cost and increasing silicon profit margins.

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Soitec announces volume manufacturing of 300mm RF-SOI substrates

Published: February 21, 2016

Soitec, France, has begun mass production of 300mm radio-frequency silicon-on-insulator (RF-SOI) substrates for mobile communications.

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Suny Polytechnic and Global Foundries establish $500 million EUV program

Published: February 21, 2016

Suny Polytechnic Institute, Utica, N.Y., and Global Foundries, Milpitas, Calif., have established a new Advanced Patterning and Productivity Center, a $500 million, five-year program to accelerate the introduction of extreme ultraviolet lithography technologies into manufacturing.

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Light industrial heat treating furnaces designed for testing facilities and labs

Published: February 16, 2016

Lindberg/MPH, Riverside, Mich., offers a light industrial furnace line that is ideal for smaller-scale operations such as testing facilities, laboratories, and small industrial plants.

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Compact noncontact surface profiler integrates three functions into sensor head

Published: February 11, 2016

Sensofar Metrology, Spain, introduces the S Lynx, a compact high-resolution noncontact 3D surface profiler that is said to integrate confocal, interferometry, and focus-variation functions into the same sensor head.

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Rare earth elements extracted from coal byproducts via ion exchange

Published: February 11, 2016

Pennsylvania State University, State College, reports that its researchers have teamed with U.S. DOE scientists to develop a cost-effective ion-exchange process to extract rare earth elements from coal byproducts.

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Lasers enable secure joining of metal and plastic

Published: February 04, 2016

The Technical University of Munich reports that its engineers are optimizing processes to securely fuse metals and thermoplastics by first texturing the metal surface with a laser beam, producing tiny hollows, then applying heat.

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Zeiss Versa X-ray microscope with FPX flat panel extension enables faster sample scanning

Published: February 01, 2016

Carl Zeiss X-ray Microscopy Inc., Germany, introduces the Xradia Versa X-ray 500-series of 3D X-ray microscopes with FPX flat panel extension, which enhances imaging flexibility and creates workflow efficiencies.

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Microchip Technology acquires Amtel to combine product portfolios

Published: January 22, 2016

Microchip Technology Incorporated, Chandler, Ariz., and Atmel Corp., San Jose, Calif., announce that Microchip has signed a definitive agreement to acquire Atmel for $8.15 per share in a combination of cash and Microchip common stock.

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Amkor Technology announces acquisition of remaining shares of J-Devices

Published: January 22, 2016

Amkor Technology Inc., Tempe, Ariz., has increased its ownership interest in J-Devices Corp., Japan, from 65.7% to 100% through the exercise of previously disclosed options.

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