Lasertec laser microscope achieves high-resolution of wafer surfaces

Published: January 22, 2016

Lasertec, Japan, offers the WASAVI series BIM300 laser microscope, which achieves high-resolution observation on wafer surfaces, as well as high precision measurement of via reveal and bump dimensions and shapes.

News, Magazine & Media / Industry News

Library of nanoporous gold structures produced on single chip via tunable lasers

Published: January 22, 2016

Lawrence Livermore National Laboratory. Livermore, Calif., reports that its researchers have created a library of nanoporous gold structures on a single chip that has direct applications for high-capacity lithium ion batteries as well as neural interfaces.

News, Magazine & Media / Industry News

SEMI Awards honor process and technology integration achievements

Published: January 22, 2016

SEMI, San Jose, Calif., announces the recipients of the 2015 SEMI Awards for innovations that have become such an integral part of the semiconductor manufacturing industry's infrastructure that the technology itself has become fundamental.

News, Magazine & Media / Industry News

Cadence and Arrow Electronics collaborate to develop integrated PCB design tools

Published: January 22, 2016

Cadence Design Systems Inc., San Jose, Calif., and Arrow Electronics, Centennial, Colo., announce a collaboration that will bring integrated design tools to engineers, helping them accelerate the pace of new product development and get products to market faster and cheaper.

News, Magazine & Media / Industry News

Orbotech to supply UV laser drilling systems for drilling vias in ceramic substrates

Published: January 22, 2016

Orbotek Ltd., Israel, has received an order for seven Emerald UV laser drilling systems to drill smaller, high-quality "via" openings in multi-layer ceramic-based IC substrates for next-generation applications.

News, Magazine & Media / Industry News

Cornell research team works to reduce GaN power diode defects and improve reliability

Published: January 20, 2016

Cornell University, Ithaca, N.Y., the University of Notre Dame, South Bend, Ind., and the semiconductor company IQE, Cardiff, Wales, put together an engineering team that has created gallium nitride (GaN) power diodes capable of serving as building blocks for future GaN power switches.

News, Magazine & Media / Industry News

Heraeus expands sources to strengthen supply chain for silver powders

Published: January 20, 2016

Heraeus Photovoltaics, Germany, announces a new and comprehensive supply chain strategy to ensure AG silver powders for its product line.

News, Magazine & Media / Industry News

Qualcomm and TDK to jointly develop RFFE modules and RF filters into integrated systems

Published: January 20, 2016

Qualcomm Inc., San Diego, Calif., and TDK Corp., Japan, have agreed to form a joint venture under the name RF360 Holdings Singapore PTE. Ltd. develop RF front-end (RFFE) modules and RF filters into fully integrated systems.

News, Magazine & Media / Industry News

Bruker introduces MultiMode 8-HR atomic force microscope for nanoscale research

Published: January 20, 2016

Bruker Nano Surfaces, Santa Barbara, Calif., announces that it has significantly enhanced the capabilities of its MultiMode platform with the MultiMode 8-HR.

News, Magazine & Media / Industry News

Bodycote produces interactive History of Metallurgy from across time and continents

Published: January 19, 2016

Bodycote, England, has produced an Interactive History of Metallurgy, a look back at the long history of metal processing and heat treatment.

News, Magazine & Media / Industry News