Brewer Science to develop nanotechnology applications for military

Published: December 12, 2015

Brewer Science, Rolla, Mo., has signed a new cooperative agreement at Missouri State University's Jordan Valley Innovation Center (JVIC) for developing nanotechnology applications to protect the U.S. military.

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Mentor Graphics Veloce emulation platform supports Andes Processors

Published: December 12, 2015

Mentor Graphics Corp., Wilsonville, Ore., announces that its Veloce emulation platform, specifically the Codelink offering, now supports the debug of designs built with AndesCore processors such as N10 and N13.

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Lasertec wafer edge inspection enables higher chip production

Published: December 12, 2015

Lasertec Corp., Japan, announces that it has launched its EZ300, a wafer edge inspection system based on a new concept that contributes to higher yields at wafer edges in the production of semiconductor chips.

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Nanodiamond-containing polymers conduct heat, resist wear

Published: December 12, 2015

Carbodeon, Finland, has been granted a U.S. patent for detonation-synthesized diamond particles (nanodiamonds) that are combined with polymers to produce wear-resistant materials with good thermal conductivity.

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Journal of Thermal Spray Technology Announces Editorial Transition

Published: December 04, 2015

After 12 years as Editor-in-Chief of the Journal of Thermal Spray Technology, Dr. Christian Moreau has transferred his responsibilities to Dr. Armelle Vardelle, who has been Lead Editor since 2013; she will be succeeded as Lead Editor by Dr. André McDonald.

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Acxys tool enables precise deposition of SiOx thin films in open air

Published: December 04, 2015

Acxys Technologies, France, has introduced its UL-Coat (ULC) module, which injects a precursor into plasma generated by its ULS plasma spot module, thus enabling deposition of thin films of SiOx in open air.

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Oxygen-free copper strip produced in continuous casting, rolling, and coiling process

Published: November 30, 2015

Mansfelder, Kupfer, und Messing GmbH (MKM), Germany, has begun the production of high-purity, oxygen-free copper strip via Conti-M technology, which makes it possible to cast, hot-roll, mill, and coil copper strip in a continuous process.

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ISTFA 2015 breaks attendance records

Published: November 18, 2015

The International Symposium for Testing & Failure Analysis (ISTFA) 2015 took Portland, Ore., by storm last week with record attendance and fun new events.

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Micron donates $25 million to Boise State for materials research

Published: November 17, 2015

Boise State University, Idaho, announces a $25 million gift from the Micron Foundation that will have a transformational impact on its engineering materials research programs.

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Akhan Semiconductor opens global headquarters in Illinois

Published: November 16, 2015

Akhan Semiconductor, Gurnee, Ill., has opened its global headquarters and production facility to develop and manufacture next-generation diamond-based semiconductors.

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