Arm Ltd. joins global research collaboration for continued scaling of semiconductors

Published: November 16, 2015

Semiconductor Research Corp., Research Triangle Park, N.C., announces that Arm Ltd., San Jose, Calif., has joined its Global Research Collaboration program.

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Jeol SEM features expanded EDS analysis, hi-rez imaging, and ports for multiple detectors

Published: November 16, 2015

Jeol USA, Peabody, Mass., introduces the JSM-IT100 scanning electron microscope, which features expanded EDS analysis capabilities and ports for multiple detectors.

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Global Foundries introduces FX-14 application-specific integrated circuit

Published: November 15, 2015

Global Foundries, Santa Clara, Calif., announces the availability of FX-14, an application-specific integrated circuit development built on the company's next-generation 14-nm FinFET process technology.

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Suss wafer bonder supports substrates with wafer size up to 200 mm

Published: November 15, 2015

Suss MicroTec, Germany, has launched XB8, a wafer bonder designed to support substrates with a wafer size up to 200 mm.

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ARM joins global research collaboration for continued scaling of semiconductors

Published: November 15, 2015

Semiconductor Research Corp., Research Triangle Park, N.C., announces that Arm Ltd., San Jose, Calif., has joined its Global Research Collaboration program.

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Jeol SEM features expanded EDS analysis, hi-res imaging, and ports for multiple detectors

Published: November 15, 2015

Jeol USA, Peabody, Mass., introduces the JSM-IT100 scanning electron microscope, which features expanded EDS analysis capabilities and ports for multiple detectors.

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Global semiconductor sales increase by 1.5% in third quarter

Published: November 15, 2015

The Semiconductor Industry Association (SIA), Washington, announces that worldwide sales of semiconductors reached $85.2 billion during the third quarter of 2015, an increase of 1.5% compared to the previous quarter.

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FEI acquires DCG for electrical fault characterization and editing equipment

Published: November 13, 2015

FEI Co., Hillsboro, Ore., has acquired DCG Systems, Fremont, Calif., a leading supplier of electrical fault characterization, localization, and editing equipment for a wide range of semiconductor and electronics manufacturers.

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Semiconductor testing method efficiently measures uniformity of conductivity

Published: November 13, 2015

Northwestern University, Evanston, Ill., reports that a new method of semiconductor characterization that is more accurate, efficient, and simple than existing methods has been developed by its researchers.

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Vanadium dioxide thin films added to transistors improve energy efficiency

Published: November 13, 2015

Scientists at Penn State University, University Park, have reportedly discovered a way to incorporate vanadium dioxide thin films into transistors and memory devices to improve energy efficiency and robustness.

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