Advanced Semiconductor Engineering Inc., Taiwan, announces that SEMI, the global micro- and nano-electronics industries association, has awarded ASE the 2014 SEMI Award for North America. Recipients of the award are Jason Chang, Chairman and CEO, and Tien Wu, COO. They are recognized for their relentless pursuit of commercializing copper wire in the IC assembly process at a time when gold wire bonding was the industry standard. The honorees accepted the award at the 2015 SEMI Industry Strategy Symposium (ISS) in Half Moon Bay, California.
In early 2005, anticipating a steep increase in gold price, ASE embarked on an ambitious push to encourage the use of copper wire bonding as an alternative to gold wire bonding. When the price of gold soared in 2007 and to all-time highs in 2011 and 2012, ASE was able to offer a proven and viable alternative.
The transition from gold to copper, however, was not without challenge. Customers were initially skeptical about the thermal and electrical performance of copper versus gold, and whether cost savings would ultimately be worthwhile. The ASE engineering team went through months and years of laborious studies, evaluations, and qualification lots, and with each successful production run, customers become increasingly confident in the company. By 2011, ASE was shipping more than four billion chips using copper wire bonding processes.
“SEMI is proud to honor ASE with a SEMI Award. Jason Chang and Tien Wu committed to resolve technical problems and address customer concerns. These two individuals, plus ASE’s willingness to underwrite risk, made a difference — and copper wire bonds are now the industry standard,” said Karen Savala, president, SEMI Americas.
