Flir Systems, Wilsonville, Oregon, has developed X6000sc and X8000sc series thermal imaging cameras with Lock-In, Transient, and Pulse capabilities for advanced inspections such as nondestructive testing or stress mapping that resolve temperature differences as low as 1 mK.
Thermal imaging cameras offer the ability to detect internal defects through target excitation and the observation of thermal differences on a target’s surface. In addition, thermal imaging cameras provide a valuable tool for detecting defects and points of failure in composites, solar cells, bridges, and electronics. They also enable thermal mapping of stress during materials testing.
The FLIR X8000sc/X6000sc Series thermal imaging cameras are designed to provide the best thermal measurement performance. Designed for scientists, engineers and researchers they can provide high resolution thermal images up to 1280 x 1024 pixels (FLIR X8400sc) that enable seeing the smallest of details with excellent measurement accuracy. These advanced thermal cameras detect temperature differences smaller than 25 mK (18 mK typically).
With Flir Systems proprietary “lock-in” process, temperature differences as small as 1mK will become clearly visible. The cameras automatically adjust their temperature range to best fit the thermal scene. Designed to unlock the secrets of almost any application, a Flir X8400sc camera can measure temperatures up to 3000°C with an accuracy of +/- 1°C, or +/- 1%, or faint thermal emissions from areas as small as 3×3 microns. The X8000sc and X6000sc Series cameras work seamlessly together with Flir ResearchIR Max software, enabling intuitive viewing, recording, and advanced processing of the thermal data provided by the camera. Each camera comes standard with this software.
