Neocera, Beltsville, Md., has developed the Magma electronic fault isolation HiRes microscope system that combines two sensors into one tool: a SQUID sensor for detecting the smallest possible currents, and a magnetoresistive sensor for best spatial resolution when scanning close to the current. Additionally, the EFI tool can detect dead open faults with high accuracy.
Die shorts are located using the HiRes sensor with better than 500nm spatial resolution. Magnetic field resolution is not limited by wavelength, but only by sensor size and scanning distance.
Leakages with mega-ohm resistance can be found with 500nA current sensitivity. Typical failures such as electromigration and dendrite formation, where high current/high voltage can heal the sample, are readily solvable with Magma microscopes.
Open failures are found using a space domain reflectometry (SDR) technique that applies a high frequency signal (20MHz to 200MHz) while detecting the RF magnetic field generated by the current. Using this technique on SOC packages with stacked die, TSVs and interposers, open failures in the silicon devices can be localized.
Neocera says that the Magma (EFI) HiRes microscope system is the ultimate tool for detecting all types of static defects at the die, package, or PC board level. Three-dimensional defect localization calculates the distance from the surface of the sample to the current path when a straight current trace is available, with new software able to recreate the current path in all three dimensions.
Package shorts are a natural fit for SQUID in Magma microscopes, since magnetic fields permeate all materials, e.g. power and ground planes, silicon, molding compounds, etc.
Die shorts are located using the HiRes sensor with better than 500nm spatial resolution. Magnetic field resolution is not limited by wavelength, but only by sensor size and scanning distance.
Leakages with mega-ohm resistance can be found with 500nA current sensitivity. Typical failures, such as electro-migration and dendrite formation, where high current/high voltage can heal the sample, are readily solvable with Magma microscopes.
Open failures are found using a space domain reflectometry (SDR) technique that applies a high frequency signal (20MHz to 200MHz) while detecting the RF magnetic field generated by the current. Using this technique on SOC packages with stacked die, TSVs and interposers, open failures in the silicon devices can be localized.
