Plasma-Therm, St. Petersburg, Fla., announces that it has acquired Kobus, a plasma deposition company that enables fast atomic sequential technology (FAST), a valuable alternative to atomic layer deposition where thick and conformal films are required. This unique deposition method is at the crossroads of ALD and CVD: FAST is enabled by proprietary CVD reactor design combined with pulsing capability, and while capable of depositing in traditional ALD mode, it is optimal for thick and conformal layer deposition and offers new solutions for 3D integration challenges.
Kobus offers a unique portfolio of equipment for both mature and advanced materials deposition, which merges well with Plasma-Therm’s operation, expanding the plasma-based deposition and etch suite of products for all silicon and compound semiconductor emerging applications.
Plasma-Therm is a U.S.-based manufacturer of plasma etch, deposition, and advanced packaging equipment for specialty semiconductor and nanotechnology markets. This acquisition will allow Plasma-Therm to establish a solid base in Europe and conduct R&D development in the Grenoble “Silicon Valley,” a region fueled with R&D, startups, and large semiconductor corporations.
