Ultra Tec., Santa Ana, Calif., announces that a new physical-contact Top Surface Scanning mode joins the feature set on Ultra Tec’s ASAP-1 in situ selected area prep system. Top Surface Scanning proves advantageous when removing distinct successive material layers within semiconductor packages — such as multi-die stacks — where single dies often need to be individually mapped to ensure resultant decapsulation success.
Top Surface Scanning, moreover, makes data immediately available to improve the final backside prep of ‘difficult’ packaged dies – with a much smaller amount of bulk die material needed for ‘re-working’ initial lower-fidelity thinning operations – such as those from low-end flat lapping systems or mills.
