FEI Co., Hillsboro, Ore., introduces two DualBeam systems that feature high-quality imaging and fast analysis over the broadest range of samples. The Helios NanoLab 660 DualBeam adds capabilities for specialized applications, such as the fabrication of prototypes for nanometer-scale devices. As shown in the photo, EasyLift’s low-drift, high-precision movements allow simple and consistent creation of traditional TEM lamellae or ultra-thin lamellae via the inverted thinning technique. The EasyLift is integrated with the microscope’s xT software to provide a simple, intuitive method for lift-out and transfer of TEM samples to a grid, all within the DualBeam chamber.
The new Scios DualBeam is specifically positioned for fast two-dimensional and three-dimensional characterization. The new detectors are able to reveal the subtle details in surface contrast. The electron optics innovations in Scios make it especially powerful for investigation of challenging materials, such as insulating or magnetic materials.
The Helios NanoLab 660, with its advanced combination of patterning engine, MultiChem gas delivery system, and Tomahawk ion optics, provides unprecedented capabilities for fabricating prototypes of complex nanodevices, enabling researchers to pioneer developments in devices such as antennas and nanofluidic systems.
For researchers working with materials that are difficult to image without coatings or preparation, the Scios offers technology innovations to mitigate these challenges. The new electron column is designed to handle characterization routines for both magnetic and non-magnetic samples. Its high-current capability provides fast X-ray analysis and can also be used to improve FIB milling accuracy on non-conductive samples by neutralizing accumulated charge.
http://www.fei.com/products/dualbeams/
