Skip to content

Advanced Materials & Processes Magazine

Advanced Materials & Processes (AM&P) is the flagship publication from ASM International. As a premier ASM Member benefit, the magazine covers topics like:

  • Leading-edge developments and trends in engineering materials, including metals and alloys, engineering polymers, advanced ceramics, and composites
  • The methods used to select, process, fabricate, test, and characterize them.
  • Emerging, potentially disruptive technologies, including nanotechnology, additive manufacturing, and materials for alternative energy
  • Management topics of importance to engineers and scientists

Print issues: ASM members (in the U.S., Canada, and Mexico) receive one year’s subscription (6 issues) to the print edition free with their membership. International ASM members can receive the print edition by paying a $30 shipping charge per year.

If you’d like to purchase a subscription to Advanced Materials & Processes (AM&P) Magazine, please contact us at [email protected] or by phone at 440.671.3800.

Digital edition: Online access to AM&P Magazine is FREE for all community users and you can update your user preferences online to receive the digital edition alerts or contact [email protected].

Interested in advertising with us! There are many opportunities available view our Media kit to learn more about these advertising opportunities or contact Kelly “KJ” Johanns, ASM Business Development Manager.

View the Media Kit

See  AM&P’s  Bronze Award for Technical Article: Historic Monel–Part II.

Advanced Materials & Processes, Volume 184, Issue 5, September 2026 (ASM International)
The September 2026 issue of Advanced Materials & Processes magazine has an editorial focus on Advanced Manufacturing.
Cover of EDFA August 2026
Electronic Device Failure Analysis, Volume 28, Issue 3, August 2026
The August 2026 issue of Electronic Device Failure Analysis includes: Expanding the Application Range of EBIRCH; Moisture and Microelectronic Devices; Automated End-to-End AI Solution for PEM; and Building Today’s Microelectronics Workforce.
Advanced Materials & Processes, Volume 184, Issue 4, July 2026 (ASM International)
The July 2026 issue of Advanced Materials & Processes magazine has an editorial focus on Testing and Characterization.
Electronic Device Failure Analysis, Volume 28, Issue 2, May 2026
The May 2026 issue of Electronic Device Failure Analysis includes: Electrical Fault Localization of Interconnect Via Chains; Inspection and Metrology Challenges in Hybrid Bonding; Failure Analysis Roadmap: Die-Level Council Update; and Advanced Fault Isolation of USB2 ESD Failures.
Advanced Materials & Processes, Volume 184, Issue 3, May 2026 (ASM International)
The May 2026 issue of Advanced Materials & Processes magazine has an editorial focus on Aerospace Materials and Testing.
Advanced Materials & Processes, Volume 184, Issue 2, March 2026 (ASM International)
The March 2026 issue of Advanced Materials & Processes magazine has an editorial focus on Additive Manufacturing.
Electronic Device Failure Analysis, Volume 28, Issue 1, February 2026
The February 2026 issue of Electronic Device Failure Analysis includes: A Step Toward Automation in Failure Analysis; Advanced FA using In-Situ AFM in FIB-SEM; Enhancing Soft Defect Localization; and Highlights from ISTFA 2025.
Advanced Materials & Processes, Volume 184, Issue 1, January 2026 (ASM International)
The January 2026 issue of Advanced Materials & Processes magazine has an editorial focus on Emerging Analysis Methods.
Electronic Device Failure Analysis, Volume 27, Issue 4, November 2025
The November 2025 issue of Electronic Device Failure Analysis includes: Chiplet Architectures for Scalable Integration; Thermal Approaches to Fault Isolation in 3D Structures; Avoiding Device Degradation through Nanoprobing; and FA Chatbot with Retrieval-Augmented Generation.
Advanced Materials & Processes, Volume 183, Issue 8, November/December 2025 (ASM International)
The November/December 2025 issue of Advanced Materials & Processes magazine has an editorial focus on Testing and Characterization.