EDFA Magazine
Volume 28, Issue 4, November 2026
The November 2026 issue of Electronic Device Failure Analysis includes: Helping Students Define Paths into Failure Analysis; Advanced Packaging Analysis: Unleashing AI’s Full Potential; Low-Temperature Failures in a Transceiver Transformer Driver; and 3D Imaging of Integrated Circuits via Limited Angle X-ray Tomography.
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Recent past editions
Volume 28, Issue 3, August 2026
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Volume 28, Issue 2, May 2026
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Volume 28, Issue 1, February 2026
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Volume 27, Issue 4, November 2025
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