Intel, Santa Clara, Calif., has released details of the Intel Core M processor, the first product to be manufactured using the optimized 14-nm manufacturing process. Intel architects and chip designers have achieved greater than two times reduction in the thermal design point when compared to a previous-generation processor, while providing similar performance and improved battery life. The new microarchitecture was optimized to take advantage of the new capabilities of the 14-nm manufacturing process. It uses second-generation Tri-gate (FinFET) transistors with industry-leading performance, power density, and cost per transistor.
The combination of the new microarchitecture and manufacturing process will usher in a wave of innovation in new form factors, experiences, and systems that are thinner and run silent and cool.
“Intel’s integrated model – the combination of our design expertise with the best manufacturing process – makes it possible to deliver better performance and lower power to our customers and to consumers,” said Rani Borkar, Intel vice president and general manager of product development. “This new microarchitecture is more than a remarkable technical achievement. It is a demonstration of the importance of our outside-in design philosophy that matches our design to customer requirements.”
These technologies provide high-performance and low-power capabilities to serve a broad array of computing needs and products, from the infrastructure of cloud computing and the Internet of Things, to personal and mobile computing.
