Ultra Tec Mfg. Inc., Santa Ana, Calif., announces that an improved machine-vision camera is now shipping with its ASAP-1 IPS units. ASAP-1 IPS is a digital sample prep system for the decapsulation, thinning, and polishing of packaged wafer-level devices. A new Electronic Video Magnifier and additional magnifying lens options make possible further milling and polishing improvements. The image shows the new (right) vs. old sample monitoring screen.
According to Tim Hazeldine, VP of Sales & Marketing, “Realtime monitoring is one of the unique benefits of the ASAP-1 IPS system and the improved optics and magnification options further compound this key user advantage. The improved optics allow for more accurate tool positioning and assist the user to identify the quality of surfaces produced. Backside preparation of small dies and multi-stack die removal are just two applications that benefit from these realtime imaging improvements.”
IPS Touch Screen OS has been designed from the ground up to control all aspects of the sample prep process. Advanced programming drives its deep submicron axes of motion. The OS contains conveniently laid out screens for the various key setup functions, such as timer, tool type, pressure monitoring, etc.
The touchoff tool control provides Z-position at pre-defined locations and pressures. This enables package and die tilt to be corrected quickly and accurately. “Tool height variations are automatically calibrated.
