Dow Corning, Midland, Mich., introduces Dow Corning CL-1000 optical silicone binder, a more thermally stable, high-refractive-index material that is formulated to expand design options for high-power chip-scale LED packaging (CSP). The latest addition to the company’s portfolio of advanced solutions for LED lighting, CL-1000 Binder offers best-in-class thermal stability and is optimized for compression molding processes. Available only in China, it leverages the same phenyl silicone chemistry as Dow Corning’s other industry-leading high RI optical encapsulants. This can help optimize the efficiency of next-generation LED lighting designs without costly investments in more powerful LED dies.
“The growing adoption of chip-scale packaging is enabling lighting designs that pack increasing numbers of LED dies more densely together in smaller form factors,” said Takuhiro Tsuchiya, global marketing manager at Dow Corning. “CL-1000 Optical Silicone Binder is Dow Corning’s response to the rapidly rising temperatures within these emerging applications. A more thermally stable iteration of our high-RI optical materials, this new product is formulated specifically to help enhance the robustness of high-power CSP designs.”
Validated through Dow Corning’s testing, its thermal stability enables it to exhibit lower degradation and improved maintenance of mechanical properties vs. other high-RI silicone encapsulants after 2000 hours exposure to temperatures above 180°C. The new high-RI material also delivers excellent photo-stability with high clarity to further support reliable performance over the life of LED devices.
The CL-1000 Binder demonstrates good conformance with highly reflective Dow Corning WR-3001 and WR-3100 Die Edge Coat materials, enabling CSP packaging with enhanced reliability over longer periods. The product’s high Shore D60 hardness also enables LED packaging to withstand dicing operations.
