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TDK to acquire Chirp Microsystems for its small-size low-power ultrasonic sensors

TDK Corp., Japan, has reached an agreement with Chirp Microsystems Inc., Berkeley, Calif., a developer of high-performance ultrasonic sensing, in which Chirp becomes a wholly owned subsidiary of TDK. Chirp is engaged in high-performance ultrasonic sensors featuring smaller sizes and lower power consumption than existing sensors. Chirp’s solutions are expected to find broader applications, such as augmented reality (AR) and virtual reality (VR), in addition to areas such as smartphones, automobiles, industrial machinery, and other ICT applications.

Chirp solutions enable extremely precise sensing, ranging from several centimeters to several meters, sensing the distance to an object and expanding the way users can operate with AR and VR, detect the proximity distance when using smartphones, and track the variance between a vehicle and obstacles when driving.

In addition, the sensor operates with low power consumption and enables products to be reduced in size, providing an outstanding sensor solution that is extremely easy for consumers to use. Furthermore, the addition of Chirp’s ultrasonic sensor solutions in combination with the existing fingerprint sensors offered by TDK subsidiary InvenSense, will significantly expand TDK’s ultrasonic sensor solutions.

“Chirp’s unique and high value-added 3D sensing technologies will fill out our lineup of sensor solutions, positioning TDK as the leader in ultrasonic MEMS technology. We aim to continue to be a reliable partner that can provide solutions to the challenges our customers face,” said Noboru Saito, Senior Vice President, TDK and CEO of Sensor Systems Business Company.

The acquisition will further accelerate TDK’s sensor and actuator business, providing an extensive sensor product lineup, including pressure, temperature, current, and magnetic sensors, as it continues to expand its sensor business.

www.global.tdk.com

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