Optomec, Albuquerque, N.M., has released its Aerosol Jet HD production system for electronics packaging, a compact, configurable production platform that can dispense a wide range of materials with features as small as 20 microns. The system can also produce larger features, from hundreds of microns to millimeters, and print wide-area conformal coatings from 100 nanometers to tens of microns in thickness.
The Aerosol Jet HD System is based on Optomec’s patented Aerosol Jet technology, used to directly print functional electronic circuitry and components onto a wide variety of substrates, both planar and non-planar, without the need for masks, screens, or subtractive post-processing. Based on the next-generation of Optomec’s production-proven Aerosol Jet print engine, the HD System provides high-resolution printed electronics for today’s most demanding advanced packaging applications such as 3D interconnects, conformal RF/EMI shielding, and precision micro-dispense of insulators and adhesives.
The in-line, modular design of the Aerosol Jet HD System enables it to seamlessly fit into almost any existing electronics manufacturing environment, filling production gaps and providing new functional printing capabilities. The solution provides a turnkey approach to advanced electronics packaging with the Aerosol Jet Print Engine and tool path generation software integrated into a standard dispense automation platform.
“The HD System builds upon our portfolio of 24X7 in-production Aerosol Jet 3D printed electronic solutions for smartphone antenna and printed sensor applications. With our 20 micron (and up) scalable production processes, the HD system is well positioned to meet today’s and tomorrow’s most demanding advanced electronic packaging market needs,” says Mike O’Reilly, Aerosol Jet Product Director.
