Lam Research Corp., Fremont, Calif., announces the launch of a completely transformed plasma etch technology and system solution, designed to provide chipmakers with advanced functionality and extendibility required for future innovation. Lam’s Sense.i platform offers unparalleled system intelligence in a compact, high-density architecture to deliver process performance at the highest productivity, supporting logic and memory device roadmaps through the coming decade.
With core technology evolved from Lam’s industry-leading Kiyo and Flex process modules, the Sense.i platform enables the critical etch capabilities required to continue advancing uniformity and etch profile control for maximizing yield and lowering wafer costs. As dimensions shrink and aspect ratios increase, the Sense.i platform is designed to support future technology inflections.
Powered by Lam’s Equipment Intelligence technology, the self-aware Sense.i platform enables semiconductor manufacturers to capture and analyze data, identify patterns and trends, and specify actions for improvement. Sense.i also features autonomous calibration and maintenance capabilities that reduce downtime and labor costs, and it delivers machine learning algorithms that allow the tool to self-adapt to minimize process variations and maximize wafer output.
The Sense.i platform has a revolutionary space-saving architecture that will help customers meet their future wafer output targets by producing more than a 50% improvement in etch output density. As semiconductor manufacturers develop smarter, faster, and denser chips, processes are rapidly growing in complexity and number of steps. This requires a greater number of process chambers in a fab and reduces total output for a given floor space. The Sense.i platform’s smaller footprint benefits either a new fab build or a fab undergoing a node-to-node technology conversion.
