Amkor Technology, Incheon, Korea, has demonstrated three new types of thermal interfacial materials (TIM) with high thermal conductivity (> 20W/mK). Workability and reliability test results for metal sheet TIM (60W/mK), graphite sheet TIM (24W/mK), and silver (Ag) sintered TIM (50W/mK) have been presented in a new paper.
The capability and diversity of high-performance microprocessors are increasing with each process technology generation to meet increasing application demands. The cooling designs for these chips must deal with larger temperature gradients across the die than previous generations. Dissipation of the thermal energy from heat generating parts to a heat sink via conduction occurs through a thermal interfacial material (TIM). One of the most important parameters of TIMs is their thermal conductivity that impacts the efficiency of thermal management.
All test package sizes were covered with 52.5-mm body size or 45-mm body size for large package with > 45-mm body size in a flip chip ball grid array (FCBGA) package. The reliability test items are high-temperature storage (HTS) @ 150’C 1000hrs, temperature cycling (TC) ‘B’ 1000X, and unbiased highly accelerated stress test (uHAST) for 96hrs. Open/short (O/S) test, scanning acoustic tomography (SAT), or X-ray analysis data were reported.
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