Researchers from Google, Mountain View, Calif., and Delft University of Technology, Netherlands, have developed a novel failure analysis hardware and sample preparation solution that enables system-level failure analysis on mobile 3D integrated circuits.
PerkinElmer, Shelton, Conn., and Covalent, Sunnyvale, Calif., announced a strategic collaboration to advance failure analysis and materials characterization for semiconductor, electronics, and battery industries.
An interdisciplinary team at the Max Planck Institute for Sustainable Materials, Germany, has identified exactly how dendrites grow and pierce ceramic electrolytes to trigger fractures that ultimately lead to battery failure.
An international research team from the Skoltech Engineering Center at the Skolkovo Institute of Science and Technology in Russia has, for the first time, directly measured mechanical stresses at the contact between a diamond indenter and a complex nanostructured coating at a resolution of less than 80 nanometers.
FormFactor, Livermore, Calif., and Keystone Microtech, Taiwan, partnership expands semiconductor probe card manufacturing and test capabilities to support advanced semiconductor applications
