Siemens, Germany, is equipping its EDA tools with secure, advanced generative and agentic AI—including integration with NVIDIA NIM microservices and Nemotron models—to boost productivity, accelerate chip and PCB design innovation, and transform development workflows from concept to verification.
Scientists at Tianjin University, China, have developed a pioneering nondestructive testing technology for micro-LED wafers, offering a much-needed solution to a long-standing industry challenge through a novel “soft-touch” approach.
SkyWater Technology, Blooington, Minn., completed its acquisition of Infineon Technologies AG’s 200 mm semiconductor fab in Austin, Texas (“Fab 25”), adding approximately 400,000 wafer starts per year in foundry capacity, to enhance its advanced technology services.
Researchers from UConn and the U.S. Naval Research Laboratory have outlined new ways to accurately track and manage heat in ultrawide bandgap semiconductors, a challenge that has become increasingly important as these materials drive the future of high-performance electronics.
A team from the Center for Optics, Photonics and Lasers at Laval University, Quebec, Canada, has come up with an optical chip that can transfer massive amounts of data at ultra-high speed, offering unrivaled energy efficiency.
