Semiconductor Research Corporation (SRC), Research Triangle Park, N.C., announces that researchers it sponsors at the Massachusetts Institute of Technology have introduced new directed self-assembly (DSA) techniques that promise to help semiconductor manufacturers develop more advanced and less expensive components.
Researchers at the Japan National Institute for Materials Science, International Center for Materials Nanoarchitectonics, and Shinshu University in Japan report that they have developed high-performance ultrathin capacitors.
Researchers at the University of California Riverside, and the University of Manchester, U.K., report that that a sandwich made of graphene on both sides of a sheet of copper improves the copper’s ability to dissipate heat by 25%.
Applied Materials Inc., Santa Clara, Calif., and Tokyo Electron Ltd., report that they have received notice from the Committee on Foreign Investment in the United States (CFIUS) that there are no unresolved national security issues relating to the proposed business combination announced last year.
Researchers at the Berkeley Lab Molecular Foundry report that they have developed rhenium disulfide, a semiconductor that functions electronically as if it were a 2D monolayer even as a 3D bulk material.
