Solar Manufacturing, Souderton, Pa., announces that it has contracted with Refrac Systems, Chandler, Ariz., to help design and build a large 100-ton-load gas fan quench vacuum hot press (GFQVHP) system for its aerospace structures diffusion bonding operation.
Jeol USA, Peabody, Mass., introduces a new benchtop SEM, the JSM-6000Plus, the third generation of the NeoScope, which delivers fast, high-magnification electron microscopy with more functionality than typical benchtop SEMs.
Cadence Design Systems Inc., San Jose, Calif., offers a foundry-proven IC packaging design and analysis solution for advanced fan-out Wafer-Level Chip Scale Packaging (WLCSP) and 2.5D interposer-based designs.
Oxford Instruments, has launched the Aztec One XT system, an ideal solution for those who want to perform a complex task such as EDS as quickly and as easily as possible.
Imec, Belgium, announces the opening of its new 4000-square-meter cleanroom facility dedicated to scaling IC technology beyond 7nm, bringing the total floor space of its semiconductor research cleanrooms to 12,000 square meters.
