Rudolph Technologies Inc., Wilmington, Mass., introduces its Clearfind technology, which can detect organic defects that are difficult or impossible to see with conventional white-light imaging techniques.
Coventor, Cary, N.C., announces that it has won the “Best of West” award presented by Solid State Technology and SEMI a the Semicon West conference July 13.
XwinSys, Carefree, Ariz., recently launched the Onyx, a novel in-line and nondestructive hybrid metrology system that uniquely integrates advanced XRF with 2D and 3D optical technologies.
FEI Co., Hillsboro, Ore., offers the Helios PFIB, said to be the world’s most advanced DualBeam Plasma FIB platform for large area deprocessing to enable electrical fault isolation of advanced process ICs and advanced failure analysis of 3D packages.
Bruker Corp., Billerica, Mass., Germany, announces that multiple leading logic and foundry manufacturers have selected Bruker’s JVX7300LSI X-ray metrology system to support their ramp and development for 10 nm and 7/5 nm technology nodes.
