The Advanced Circuit Materials Division of Rogers Corp., Rogers, Conn., launches Coolspan thermally and electrically conductive adhesive (TECA) film.
Silver-filled adhesive film enables high-temperature operation
Altera and Intel to collaborate on multi-die devices
Altera Corp., San Jose, Calif., and Intel Corp., Santa Barbara, Calif., announce their collaboration on the development of multi-die devices that leverage Intel’s world-class package and assembly capabilities and Altera’s leading-edge programmable logic technology.
Erbium-antimony nanostructures manipulate light in the infrared range
Researchers at the University of California at Santa Barbara have developed an erbium-antimony semiconductor of nearly perfect quality that can manipulate light energy in the mid-infrared range.
Scalable CVD process enables one atom-thick layers of molybdenum diselenide semiconductor
Researchers at Rice University in Houston and Nanyang Technological University in Singapore have developed a potentially scalable CVD method for making one-atom-thick layers of molybdenum diselenide.
Bruker Introduces online XRF coating analyzer
Bruker Corp., Santa Barbara, Calif., presents an online coating analyzer, the S2 Kodiak, which is based on X-ray fluorescence spectrometry.