EDFA Magazine
Volume 26, Issue 4, November 2024
The November 2024 issue of Electronic Device Failure Analysis includes: Celebrating 50 Years of ISTFA; Four-dimensional STEM: Part III, Ptychography; Nondestructive 3D X-ray Microscopy Speeds Throughput; Specimen Thinning by Argon Ion Beam Milling; and TEM Samples with PFIB and STEM EBIC.
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Recent past editions
Volume 28, Issue 3, August 2026
Magazine (Global)
Volume 28, Issue 2, May 2026
Magazine (Global)
Volume 28, Issue 1, February 2026
Magazine (Global)
Volume 27, Issue 4, November 2025
Magazine (Global)