New material could make it possible to pack more transistors on a chip, research suggests.
Micro-reactor produces silver nanoparticles at room temperature for printed circuits
Engineers at Oregon State University, Corvallis, report that they have invented a way to fabricate silver nanoparticles that are produced at room temperature for printed electronics.
SPP Technologies to acquire Orbotech’s SPTS Technologies Thermal Products business
Orbotech Ltd., Israel, announces that SPTS Technologies Group (SPTS), U.K., an Orbotech company and supplier of advanced wafer processing solutions, has sold its Thermal Products business to SPP Technologies Co. (SPT), a subsidiary of Sumitomo Precision Products Co.
Nordson March plasma treatment systems designed for packaging applications
Nordson March, Concord, Calif., announces its new Sphere Series plasma treatment systems for wafer-level and 3D packaging applications.
Photo-doping of semiconductor enables formation of new material phases
Researchers at Michigan State University, East Lansing, report that by shooting an ultrafast laser pulse into a semiconductor, its properties change as if it had been chemically doped.