Progressive Surface, Grand Rapids, Mich., recently installed three 100HE plasma spray systems in a semiconductor manufacturing facility.
Picosun ALD technology enables uniform gold films on silicon wafers
Picosun Oy, Finland, and Carleton University, Ottawa, have collaborated to develop a process in which atomic layer deposition (ALD) technology deposits thin uniform gold films on complete silicon wafers.
Microindentation offers hope for high-throughput testing
Researchers at the Georgia Institute of Technology have developed a protocol using multi-scale modeling to determine tensile yield strength from microindentation tests. Micro indentation offers all the advantages of a high-throughput measurement technique.
Ultra 76 Plus tantalum alloy resists corrosion in hot concentrated acids
H.C. Starck, Newton, Mass., introduces the Ultra 76 Plus tantalum alloy, which is designed to combat aggressive hazardous-chemical corrosion in hot concentrated acids.
Ultra 76 Plus tantalum alloy resists corrosion in hot concentrated acids
H.C. Starck, Newton, Mass., introduces the Ultra 76 Plus tantalum alloy, which is designed to combat aggressive hazardous-chemical corrosion in hot concentrated acids.