Suss MicroTec, Germany, introduces the XB8 semi-automated wafer bonding platform, which supports substrates with a wafer size of up to 200 mm.
Suss MicroTec launches semi-automated high-force wafer bonder
Heat Treat expo sells out
The exposition for Heat Treat 2015 has sold out for the second time in a row.
Pressure causes osmium to change state of matter
Using metallic osmium (Os) in experimentation, an international group of researchers demonstrated that ultra-high pressures cause core electrons to interplay, which results in experimentally observed anomalies in the compression behavior of the material. Os is one of Earth’s most exceptional elemental materials, possessing the highest known density at ambient pressure, one of the highest cohesive […]
One Minute Mentor: Tempering Powder Metallurgy Steels
Usually, powder metallurgy steel parts having a density greater than 6.7 g/cm3 (0.242 lb/in.3) should be tempered after hardening. Recommended tempering temperatures for PM parts range from 150 to 200°C (300 to 390°F) with 175°C (350°F) being common.
Macom announces milestone in the commercialization of GaN on silicon technology
Macom Technology Solutions Inc., Lowell, Mass., reports that it has shipped more than one million GaN-on-Silicon (GaN on Si) RF power devices to date for communications, military, and other RF applications.