Applied Materials, Inc., Santa Clara, Calif., and CEA-Leti, France, announced the next phase of their longstanding collaboration to accelerate innovation in specialty semiconductors, expanding their joint lab and developing materials engineering solutions to address emerging infrastructure challenges in AI data centers.
Instron, Norwood, Mass., released the AVE3, an advanced non-contacting video extensometer that delivers precise strain measurement with unparalleled, micron-level accuracy for tensile, compression, and bend testing.
Czech-based electron microscope manufacturer TESCAN plans to establish a local subsidiary in Taiwan in 2025 to meet rising demand from semiconductor clients across the Asia-Pacific region. Founded in Brno, the Czech Republic’s second-largest city, TESCAN built its reputation over three decades in fields like materials science and geoscience. In recent years, however, the company has […]
Knut and Alice Wallenberg Foundation and the WISE research program, Sweden, have launched a Proof-of-Concept Grant program with the purpose to bridge the gap from academic research to innovations in materials science for sustainability.
University of Cincinnati co-op student Addie Salvador is quietly reshaping the future of materials science, bringing autonomy to a transmission electron microscope in the cutting-edge laboratories of the National Renewable Energy Laboratory in Golden, Colorado.
