Ultra Tec Manufacturing, Santa Ana, Calif., has developed new hybrid 3D backside thinning and polishing techniques for the achievement of extremely uniform remaining silicon thickness.
Bruker Corp., Billerica, Mass., has released its new Contour Elite 3D Optical Microscopes, which for the first time fully integrate high-definition microscopy imaging with industry-leading three-dimensional optical metrology functionality.
FEI, Hillsboro, Ore., introduces the DualBeam plasma-focused ion beam (PFIB) for sample preparation, electrical fault isolation, and electrical failure analysis on sub-20nm semiconductor devices.
DCG Systems, Fremont, Calif., has acquired the assets of MultiProbe, the leading provider of atomic force-based nanoprobe solutions for the semiconductor industry.
Researchers from Stanford University, Stanford, Calif., report that they have developed graphene sheathing material for the copper wires in computer chips.
