Oxford Instruments Asylum Research, Santa Barbara, Calif., announces the opening of its first Nanotechnology Lab for Atomic Force Microscopy (AFM) in Mumbai, India.
Oxford Instruments Asylum Research opens AFM demo lab in Mumbai
ClassOne electroplating tool designed for 100 to 200-mm substrates
ClassOne Technology, Kalispell, Mont., has launched its Solstice line of electroplating tools designed specifically for 100 to 200-mm substrates.
SUSS MicroTec launches ELD 300 excimer laser debonder for 3D integration
SÜSS MicroTec, Germany, has launched an excimer laser debonder, the ELD300, for the stress-free debonding of 200 and 300-mm 3D-IC wafers.
Power Electronics Manufacturing Consortium to develop silicon carbide electronic devices
New York State and more than 100 companies, led by General Electric, Schenectady, N.Y., will collaborate to launch the New York Power Electronics Manufacturing Consortium at the SUNY College of Nanoscale Science and Engineering in Albany.
AFM with automated defect review of bare wafers increases production throughput by 1000%
Park Systems, Santa Clara, Calif., announces Park NX-Wafer, an AFM designed for bare wafer manufacturing that fully automates the automatic defect review process.