Duke University, Durham, N.C., announces that its researchers have introduced probing solutions that may enable pre-bond and post-bond testing of through-silicon vias and logic dies used in manufacturing semiconductor components.
Fujitsu Laboratories, Japan, has reportedly developed the world’s first thin heat pipe designed for small electronic devices.
The Ghost fast attack stealth boat is a supercavitating surface craft that can achieve hull friction reduced by a factor of 900 compared to a conventional watercraft.
As aircraft interior designers seek to achieve modern, light-filled cabin environments, they require a range of transparent materials that meet the industry’s vertical burn standards and are amenable to different processing technologies.
Perhaps no aspect of 3D printing has captured the popular imagination more than personalized figurines with the facial features of real people.
