Cardiff University and IQE plc, both of Wales, announce a joint venture to build the Compound Semiconductor Centre, which has the goal of developing and commercializing next-generation compound semiconductor technologies.
On Semiconductor Corp., Phoenix, Ariz., and Fairchild Semiconductor Intl. Inc., South Portland, Maine, announce plans for On Semiconductor to acquire Fairchild for $20.00 per share in an all cash transaction valued at approximately $2.4 billion.
Goodfellow Corp., Coraopolis, Pa., reports that its microporous copper foam coated with a thin, hard layer of copper oxide provides outstanding performance as a low-profile heat sink in passive cooling environments.
FEI Co., Hillsboro, Ore., introduces the Helios G4 HX as the industry’s highest throughput, dedicated TEM lamella preparation platform, designed to meet the challenges of advanced semiconductor failure analysis labs.
Bruker AXS, Madison, Wis., introduces the D8 Gen 2, which features the latest version of the Incoatec Microfocus Source, the IµS 3.0, the first microfocus source specifically designed and optimized for X-ray diffraction.
