Northwestern University, Evanston, Ill., reports that a new method of semiconductor characterization that is more accurate, efficient, and simple than existing methods has been developed by its researchers.
Scientists at Penn State University, University Park, have reportedly discovered a way to incorporate vanadium dioxide thin films into transistors and memory devices to improve energy efficiency and robustness.
Ultratech Inc., San Jose, Calif., introduces the Superfast 4G+ in-line 3D topography wafer inspection system featuring coherent gradient sensing technology that enables a single wafer inspection tool to measure patterned wafers across the entire fab line at the lowest cost.