FEI Co., Hillsboro, Ore., offers the Helios NanoLab 460F1, which combines the highest resolution scanning electron microscope (Elstar+UC SEM) and focused ion beam (Tomahawk FIB) columns on the market today with the most advanced sample manipulation capabilities.
Jeol USA, Peabody, Mass., announces that a state-of-the-art Jeol e-beam lithography system will soon be installed at the University of Waterloo Quantum NanoFab in Waterloo, Ontario.
Park Systems, Santa Clara, Calif., introduces the NX-Hivac AFM system for semiconductor failure analysis.
Kyocera America Inc., San Diego, announces the U.S. introduction of its XT2773R7 Silver Sinter Paste, a proprietary formulation specifically developed to deliver higher performance than high-lead solders.
Applied Materials Inc., Santa Clara, Calif., introduces the Applied Endura Cirrus HTX PVD titanium nitride hardmask system with advanced technology for patterning copper interconnects at 10 nm and beyond.
