Imec, Belgium, and Lam Research Corp., Fremont, Calif., have reportedly developed a novel bottom-up cobalt prefill technique for vias and contacts for electronic chips.
The Agency for Science, Technology, and Research (A-Star), Singapore, reports that a laser-induced thermal cracking technology for cutting silicon wafers could streamline the production of smaller and more powerful microchips for electronic devices.
Researchers at the University of Illinois, Champaign, have reportedly developed heat-triggered self-destructing electronic devices.
Sematech, Albany, N.Y., and Exogenesis Corp., Billerica, Mass., have agreed to a strategic alliance to commercialize the Exogenesis Accelerated Neutral Atom Beam (ANAB) process technology and the nAccel accelerated particle beam equipment platform.
ASM International and Granta Design, leaders in materials information technology, today announced major updates to the ASM Medical Materials Database™. The spring release of this resource includes new data on materials including stainless steels and tool steels, expanded coverage of the latest additive manufacturing techniques, and the addition of the latest FDA approved devices (510k and PMA) with links to associated materials, coatings and drugs.
