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Home Search results for: -/journal_content/56/10192/39892774/PUBLICATION

Sandia, Purdue University establish strategic alliance to speed adoption of technology

Sandia National Laboratories, Albuquerque, N.M., and Purdue University, West Lafayette, Ind., have signed an extensive, five-year memorandum of understanding (MOU) to establish a strategic alliance that seeks to solve large national problems, sustain and engage human capital, and accelerate adoption of technology.

Fifty years of Moore’s Law results in 1.3 transistors on a single integrated circuit

Semi, San Jose, Calif., reports that April 2015 marks the 50th anniversary of Moore’s Law.

Duke researchers develop probes for bond testing of 3D integrated circuits

Duke University, Durham, N.C., announces that its researchers have introduced probing solutions that may enable pre-bond and post-bond testing of through-silicon vias and logic dies used in manufacturing semiconductor components.

Thin porous copper sheets transfer five times more heat from electronic devices

Fujitsu Laboratories, Japan, has reportedly developed the world’s first thin heat pipe designed for small electronic devices.

SUPER FAST Stealth Attack Boat for the US Military and Navy

The Ghost fast attack stealth boat is a supercavitating surface craft that can achieve hull friction reduced by a factor of 900 compared to a conventional watercraft.

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