3D-Micromac AG, Germany, highlighted its microPREP L laser-based sample preparation system for advanced semiconductor packaging failure analysis and quality assurance, enabling targeted defect access across samples ranging from individual dies to full 300-mm wafers and system-level boards.
Synopsys, Sunnyvale, Calif., and OpenAI, San Francisco, Calif., have partnered to bring together OpenAI’s advanced AI capabilities with Synopsys’ industry-leading electronic design automation tools and agentic AI capabilities to revolutionize the design of semiconductors.
Hamamatsu Photonics, Japan, developed the iPHEMOS-DDX, an inverted emission microscope designed for failure analysis of advanced semiconductor packages, including AI chiplets, high bandwidth memory, 2.5D/3D packages, and large-scale semiconductor packages.
NASA Glenn shows a shape memory alloy torque-tube actuator folding an aircraft wingtip in flight.
In this video, see the prototype steering wheel developed at the University of Michigan and the Toyota Research Institute that uses haptic feedback to allow drivers to communicate with their vehicle’s autonomous systems.
